|Deposition Rate (BOL)||um/min||> 1.5||> 1.0|
|Film Uniformity (Rs)||%||< 3%||< 3%|
|Resistivity||uohm-cm||2.7 ~ 3.2||2.7 ~ 3.2|
|Stress||MPa||< 300, Tensile||< 300, Tensile|
|Reflectance||%||> 180%||> 180%|
|Defects||No hillock, No extrusion||No hillock, No extrusion|
|Process kit life time (ESC)||KWh||Up to 450||Up to 450|
Newly developed hardware and cooling mechanism
Compact cooling system for source assembly
Improved ESC-cooling retrofit kit
Process performance repeatability
Customer Demonstrations Available
It uses high power to shorten the duration of the deposition process, thereby enhancing throughput.
Enhanced hardware prevents formation of whiskers or extrusions and able to maintain film properties as standard Al deposition chamber.
Process can be optimized to meet specific customer requirements. The process of passing through three chambers can be effectively accomplished using a single chamber.
Compared to OEM products, CoolKAT has the equivalent performance with better cost in terms of initial deployment and maintenance.